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  si9953dy si9953dy rev. a si9953dy* dual p-channel enhancement mode mosfet features ? -2.3 a, -20 v. r ds(on) = 0.250 w @ v gs = -10 v r ds(on) = 0.400 w @ v gs = -4.5 v. ? low gate charge. ? fast switching speed. ? high power and current handling capability. ? 1999 fairchild semiconductor corporation june 1999 applications ? battery switch ? load switch ? motor controls general description these p-channel enhancement mode mosfets are produced using fairchild semiconductor's advance process that has been especially tailored to minimize on- state resistance and yet maintain superior switching performance. these devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. $evroxwh0d[lpxp5dwlqjv  7 $  r &xqohvvrwkhuzlvhqrwhg 6\pero 3dudphwhu 5dwlqjv 8qlwv 9 '66 'udlq6rxufh9rowdjh  9 9 *66 *dwh6rxufh9rowdjh  9 , ' 'udlq  &xuuhqw   &rqwlqxrxv   1rwh  d  $ 3xovhg  3rzhu'lvvlsdwlrqiru'xdo2shudwlrq  3rzhu  'lvvl s dwlrq  iru  6lq j oh  2 s hudwlrq  1rwh  d   1rwh  e  3 '  1rwh  f  : 7 - 7 67* 2shudwlqjdqg6wrudjh-xqfwlrq7hpshudwxuh5dqjh wr & 7khupdo&kdudfwhulvwlfv 5 q -$ 7khupdo5hvlvwdqfh-xqfwlrqwr$pelhqw  &: 5 q -& 7khupdo5hvlvwdqfh-xqfwlrqwr&dvh 1rwh  &: 3dfndjh0dunlqjdqg2ughulqj,qirupdwlrq 'hylfh0dunlqj 'hylfh 5hho6l]h 7dshzlgwk 4xdqwlw\  6l'< ?? pp xqlwv  'lh  dqg  pdqxidfwxulq j vrxufh  vxe m hfw  wr  fkdq j h  zlwkrxw s ulru  qrwlilfdwlrq  ' 62 ' ' ' 6 6 * *        
si9953dy si9953dy rev. a (ohfwulfdo&kdudfwhulvwlfv 7 $  ?&xqohvvrwkhuzlvhqrwhg 6 \ pero 3dudphwhu 7hvw&rqglwlrqv 0lq 7\s 0d[ 8qlwv 2ii&kdudfwhulvwlfv %9 '66 'udlq6rxufh%uhdngrzq 9rowdjh 9 *6  9, '   m $ 9 d %9 '66 d 7 - %uhdngrzq9rowdjh 7hpshudwxuh&rhiilflhqw , '   m $5hihuhqfhgwr &p9 & , '66 =hur*dwh9rowdjh'udlq &xuuhqw 9 '6  99 *6  9 9 '6  99 *6  97 -   &   m $ , *66) *dwh%rg\/hdndjh&xuuhqw )ruzdug 9 *6  99 '6  9  q$ , *665 *dwh%rg\/hdndjh&xuuhqw 5hyhuvh 9 *6  99 '6  9  q$ 2q&kdudfwhulvwlfv  1rwh 9 *6 wk *dwh7kuhvkrog9rowdjh 9 '6  9 *6 , '   m $ 9 d 9 *6 wk d 7 - *dwh7kuhvkrog9rowdjh 7hpshudwxuh&rhiilflhqw , '   m $5hihuhqfhgwr &p9 & 5 '6 rq 6wdwlf'udlq6rxufh 2q5hvlvwdqfh 9 *6  9, '  $ 9 *6  9, '  $7 -  & 9 *6  9, '  $       w , ' rq 2q6wdwh'udlq&xuuhqw 9 *6  99 '6  9 9 *6  99 '6  9   $ j )6 )ruzdug7udqvfrqgxfwdqfh 9 '6  9, '  $  6 '\qdplf&kdudfwhulvwlfv & lvv ,qsxw&dsdflwdqfh  s) & rvv 2xwsxw&dsdflwdqfh  s) & uvv 5hyhuvh7udqvihu &dsdflwdqfh 9 '6  99 *6  9 i 0+]  s) 6zlwfklqj&kdudfwhulvwlfv  1rwh w g rq 7xuq2q'hod\7lph   qv w u 7xuq2q5lvh7lph   qv w g rii 7xuq2ii'hod\7lph   qv w i 7xuq2ii)doo7lph 9 ''  9, '  $5 /   w 9 *6  95 *(1   w qv w uu 'udlq6rxufh5hyhuvh 5hfryhu\7lph , ) $glgw $ m v  q6 4 j 7rwdo*dwh&kdujh   q& 4 jv *dwh6rxufh&kdujh  q& 4 jg *dwh'udlq&kdujh 9 '6  9, '  $ 9 *6  9  q& 'udlq6rxufh'lrgh&kdudfwhulvwlfvdqg0d[lpxp5dwlqjv , 6 0d[lpxp&rqwlqxrxv'udlq6rxufh'lrgh)ruzdug&xuuhqw  $ 9 6' 'udlq6rxufh'lrgh)ruzdug 9rowdjh 9 *6  9, 6  $  1rwh   9 notes: 1. r q ja is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mou nting surface of the drain pins. r q jc is guaranteed by design while r q ca is determined by the user's board design. scale 1 : 1 on letter size paper 2. pulse test: pulse width 300 m s, duty cycle 2.0% a) 78 c/w when mounted on a 0.5 in 2 pad of 2 oz. copper. b) 125 c/w when mounted on a 0.02 in 2 pad of 2 oz. copper. c) 135 c/w when mounted on a minimum pad of 2 oz. copper.
soic(8lds) packaging configuration: figure 1.0 components leader tape 1680mm minimum or 210 empty pockets trailer tape 640mm minimum or 80 empty pockets soic(8lds) tape leader and trailer configuration: figure 2.0 cover tape carrier tape note/comments packaging option soic (8lds) packaging information standard (no flow code) l86z f011 packaging type reel size tnr 13" dia rail/tube - tnr 13" dia qty per reel/tube/bag 2,500 95 4,000 box dimension (mm) 355x333 x40 530x130x83 355x333 x40 max qty per box 5,000 30,000 8,000 d84z tnr 7" dia 500 193x183x80 2,000 weight per unit (gm) 0.0774 0.0774 0.0774 0.0774 weight per reel (kg) 0.6060 - 0.9696 0.1182 f63tnr label sample lot: cbvk741b019 fsid: fds9953a d/c1: z 9842ab qty1: spec rev: spec: qty: 2500 d/c2: qty2: cpn: n/f: f (f63tnr)3 f 852 nds 9959 soic-8 unit orientation f 852 nds 9959 pin 1 static dissipative embossed carrier tape f63tnr label antistatic cover tape customized label packaging description: soic-8 parts are shipped in tape. the carrier tape is made from a dissipative (carbon filled) polycarbonate resin. the cover tape is a multilayer film (heat activated adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. these reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. the reels are dark blue in color and is made of polystyrene plastic (anti- static coated). other option comes in 500 units per 7" or 177cm diameter reel. this and some other options are further described in the packaging information table. these full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. one box contains two reels maximum. and these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. f 852 nds 9959 f 852 nds 9959 f 852 nds 9959 embossed esd marking attention observe precautions for handling electrostatic sensitive devices embossed esd marking attention observe for handling electrostatic sensitive devices attention observe for handling electrostatic sensitive devices a ttention obser ve for handling a ttention obser ve for handling a ttention obser ve preca utions for handling electr ost a tic sensitive devices 193mm x 183mm x 80mm pizza box for standard option barcode label barcode label barcode label 355mm x 333mm x 40mm intermediate container for 13 reel option soic-8 tape and reel data january 2001, rev. c ?2001 fairchild semiconductor corporation
? 1998 fairchild semiconductor corporation dimensions are in millimeter pkg type a0 b0 w d0 d1 e1 e2 f p1 p0 k0 t wc tc soic (8lds) (12mm) 5.30 +/-0.10 6.50 +/-0.10 12.0 +/-0.3 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 10.25 min 5.50 +/-0.05 8.0 +/-0.1 4.0 +/-0.1 2.1 +/-0.10 0.450 +/- 0.150 9.2 +/-0.3 0.06 +/-0.02 p1 a0 d1 p0 f w e1 d0 e2 b0 tc wc k0 t dimensions are in inches and millimeters tape size reel option dim a dim b dim c dim d dim n dim w1 dim w2 dim w3 (lsl-usl) 12mm 7" dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 ? 0.606 11.9 ? 15.4 12mm 13" dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 7.00 178 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.469 ? 0.606 11.9 ? 15.4 see detail aa dim a max 13" diameter option 7" diameter option dim a max see detail aa w3 w2 max measured at hub w1 measured at hub dim n dim d min dim c b min detail aa notes: a0, b0, and k0 dimensions are determined with respect to the eia/jedec rs-481 rotational and lateral movement requirements (see sketches a, b, and c). 20 deg maximum component rotation 0.5mm maximum 0.5mm maximum sketch c (top view) component lateral movement typical component cavity center line 20 deg maximum typical component center line b0 a0 sketch b (top view) component rotation sketch a (side or front sectional view) component rotation user direction of feed soic(8lds) embossed carrier tape configuration: figure 3.0 soic(8lds) reel configuration: figure 4.0 soic-8 tape and reel data, continued january 2001, rev. c
soic-8 (fs pkg code s1) 1 : 1 scale 1:1 on letter size paper di me n si o n s s h ow n be l ow a re in : inches [millimeters] part weight per unit (gram): 0.0774 soic-8 package dimensions september 1998, rev. a 9 ?2000 fairchild semiconductor international
trademarks the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. powertrench qfet? qs? qt optoelectronics? quiet series? silent switcher smart start? supersot?-3 supersot?-6 supersot?-8 fastr? globaloptoisolator? gto? hisec? isoplanar? microwire? optologic? optoplanar? pacman? pop? rev. g ? acex? bottomless? coolfet? crossvolt ? dome? e 2 cmos tm ensigna tm fact? fact quiet series? fast syncfet? tinylogic? uhc? vcx? ? ?


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